HDTutorial
EN
How to Manipulate Elements of IC Package in SIwave for Model Extraction

Playback starts YouTube’s embedded player (privacy-enhanced mode).

How to Manipulate Elements of IC Package in SIwave for Model Extraction

2,479 views November 8, 2019 10:47

Watch on YouTube
ChannelHowtoSim

Description from the creator

如何在SIwave中操作IC封裝元件進行模型提取

SIwave中的IC封裝由不同類型的元素定義，包括疊層，焊盤，鍵合線，跡線，平面，焊球和元件。 我將通過一個簡單的例子向您展示這些元素。 了解如何微調這些組件將有助於我們有效地提取複雜的IC封裝模型。

IC package in SIwave is defined in different types of elements, including stackup, padstack, bondwire, trace, plane, solderball and components. I'll show you these elements with a simple example. Understand how to fine tune these components will help us to extract complex IC package model effectively and efficiently.

About this tutorial

HowtoSim published this 10:47 video tutorial on November 8, 2019. It has been watched 2,479 times on YouTube.

Channel
HowtoSim
Duration
10:47
Published
November 8, 2019
Views
2,479
Likes
15

Tags

Share

This tutorial in other languages